| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an interlayer insulating resin film suitable for manufacturing a printed wiring board that has conductor circuits made high in density without making a wiring width small and also has superior inter-line and interlayer insulation and connection reliability between the conductor circuits in order to provide the printed wiring board having the conductor circuits made high in density. <P>SOLUTION: The interlayer insulating resin film (F) for the printed wiring board has a photosensitive resin layer (A) containing a polyimide precursor (a) laminated first on a support base film (C) and also has a thermosetting resin layer (B) containing an epoxy resin (b) containing two or more epoxy groups in one molecule, further laminated thereupon, wherein a coefficient of thermal expansion that the photosensitive resin layer (A) after curing between 30 and 150°C is≤60 ppm/°C, and a coefficient of average thermal expansion that the thermosetting resin layer (B) after curing between 30 and 150°C is≤60 ppm/°C. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
