| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil for a printed circuit board that is superior in both adhesive strength to an insulating substrate and etching property without using Cr, and suitable to fine pitch fabrication. SOLUTION: The copper foil for the printed circuit board includes a copper foil base and a coating layer covering at least part of a copper foil base surface, wherein (1) the coating layer is composed of an Ni layer and an Al layer laminated in order from the copper foil base surface, and (2) the coating layer contains Al by 100 to 1,300μg/dm<SP>2</SP>and Ni by 40 to 600μg/dm<SP>2</SP>in terms of coating amount. COPYRIGHT: (C)2011,JPO&INPIT
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