| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging apparatus for radiating heat generated from built-in components, achieving reduction in size, and attaining a simplified assembling process. SOLUTION: Radiation of heat generated from built-in components, reduction in size, and simplified assembling can be achieved by forming a structure that a metal fixing member 5, to which a main substrate 6 mounting a CMOS sensor 7 is fixed, is fixed to a front cover 3 in such a way that the main substrate 6 faces the front cover, an auxiliary substrate 9 loading a connector is fixed to bosses 11a, 11b integrated to the fixing member 5 in opposition to a rear cover, and the rear cover 4 is finally assembled. COPYRIGHT: (C)2011,JPO&INPIT
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