Provided is an electronic apparatus equipped with a heat generating electronic component and an apparatus for air-cooling the heat generating electronic component. The electronic apparatus is provided with a heat dissipation module, which has heat dissipation fins in contact with the heat generating electronic component, a fan for supplying air toward the heat dissipation fins, and a base body for supporting the fan and supporting the heat dissipation fins at a position biased closer to the side of a shield plate than the fan and having a slope formed between the fan and the heat dissipation fins in order to lead supply air from the fan to the heat dissipation fins. The heat dissipation module is mounted at a position between the shield plate and a circuit board where supply air passed through the heat dissipation fins is discharged from an air discharge opening. The shield plate has a raised piece facing the slope and leading supply air from the fan toward the heat dissipation fins obliquely along the slope.
