发明名称 |
COOLING DEVICE, ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE |
摘要 |
A cooling device is provided. The cooling device is equipped with an electronic substrate on which a heating element has been mounted, and comprises a thermal diffusion unit of a plate-like shape. A front surface of the thermal diffusion unit thermally contacts a first circuit mounting surface of the electronic substrate. A rear face of the thermal diffusion unit thermally contacts a second circuit mounting surface of the electronic substrate. And, the thermal diffusion unit diffuses heat from the heating element according to vaporization and condensation principles of a refrigerant sealed therein. |
申请公布号 |
WO2010121230(A1) |
申请公布日期 |
2010.10.21 |
申请号 |
WO2010US31526 |
申请日期 |
2010.04.16 |
申请人 |
MOLEX INCORPORATED;NAGASAWA, HIDEO |
发明人 |
NAGASAWA, HIDEO |
分类号 |
H01L23/427;H01L23/36;H05K1/14;H05K7/20 |
主分类号 |
H01L23/427 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|