发明名称 |
CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>The conductive member has a stable contact resistance, resists peeling, displays a low insertion/removal force and is stable when used as a connector, and has an excellent fusing characteristic when used as a fuse. A Cu-Sn intermetallic compound layer (4) is formed between a Ni-based underlayer (3) formed on a Cu-based base material (1), and a Sn-based surface layer (5) that forms the surface. In addition, the Cu-Sn intermetallic compound layer (4) comprises a Cu3Sn layer (6) disposed on the Ni-based underlayer (3) and a Cu6Sn5 layer (7) that is disposed on the Cu3Sn layer (6). The surface roughness of the contact face between the Sn-based surface layer (5) and the Cu-Sn intermetallic compound layer (4) combining the Cu3Sn layer (6) and Cu6Sn5 layer (7) has an arithmetic mean roughness Ra of 0.05-0.25 µm, and the maximum valley depth Rv of the roughness curve is 0.05-1.00 µm. Furthermore, the Cu3Sn layer covers the Ni-based underlayer with a surface coverage of 60-100%.</p> |
申请公布号 |
WO2010119489(A1) |
申请公布日期 |
2010.10.21 |
申请号 |
WO2009JP03280 |
申请日期 |
2009.07.13 |
申请人 |
MITSUBISHI SHINDOH CO., LTD.;SAKURAI, TAKESHI;ISHIKAWA, SEIICHI;KUBOTA, KENJI;TAMAGAWA, TAKASHI |
发明人 |
SAKURAI, TAKESHI;ISHIKAWA, SEIICHI;KUBOTA, KENJI;TAMAGAWA, TAKASHI |
分类号 |
C25D7/00;C25D5/12;C25D5/50;H01H85/06;H01R13/03 |
主分类号 |
C25D7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|