SYSTEM AND METHOD FOR COOLING AN ELECTRONIC DEVICE

摘要

An exemplary embodiment of the present invention provides a system for cooling an electronic device. The system includes a plenum disposed adjacent to an interior surface of a housing for the electronic device, wherein the plenum is placed between a heat generating component and the interior surface of the housing, and wherein the plenum reduces heat transfer from the heat generating component to an exterior surface of the housing. The system also includes a fan configured to create an airflow in the plenum.