| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition which, as a chemically amplified resist, is high in transparency to radiation and superior in resolution and is not only superior in dry-etching resistance, sensitivity, and pattern shape or the like, but also remarkably improves the yield of semiconductor elements by suppressing the occurrence of development defects during microfabrication. <P>SOLUTION: The radiation sensitive resin composition includes a resin (A) including an acid dissociable group, a compound (B) which generates an acid by irradiation with active light or radiation, and a compound (C) which includes a cyclodextrin skeleton and a fluorine atom in a molecular structure and includes ≤6,000 average molecular weight calculated from<SP>1</SP>H NMR. <P>COPYRIGHT: (C)2011,JPO&INPIT |
