| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board capable of normally forming a build-up wiring conductor composed of a plurality of layers at any time. SOLUTION: A position where a feeding terminal 5 for electrolytic plating adheres closely to a base plating layer of the first layer of a connecting conductor 4 for power supply formed on an allowance area 3 on a panel 1 for a wiring board, and a position where the feeding terminal 5 for electrolytic plating adheres closely to a base plating layer of the second layer of the connecting conductor 4 are made different from each other. When the feeding terminal 5 for electrolytic plating is connected to the base plating layer of the second layer of the connecting conductor 4 for power supply, the connecting conductor 4 for power supply does not become thin in a section to which the feeding terminal 5 is connected. As a result, the second layer of the electrolytic plating layer can be formed stably with a predetermined thickness. COPYRIGHT: (C)2011,JPO&INPIT |
