| 摘要 |
PROBLEM TO BE SOLVED: To prevent occurrence of transportation trouble during a manufacturing process by enhancing rigidity of a start material, for improved productivity. SOLUTION: A prepreg is arranged around a support substrate 100, and first copper foil layers 210 and 310 are arranged on both surfaces thereof. Second prepregs 220 and 320 are arranged over them, and second copper foil layers 230 and 330 are arranged over them. A first lamination press is performed thereafter. Then, third prepregs 240 and 340 are further arranged on respective second copper foil layers, and third copper foil layers 250 and 350 are arranged over them. A second lamination press is performed thereafter. Then fourth prepregs 260 and 360 are further arranged on the third copper foil layers 250 and 350, and fourth copper foil layers 270 and 370 are arranged over them. A third lamination press is performed thereafter. Then it is cut along a predetermined contour line C inside the end part of the support substrate 100, to separate peripheral prepreg joint portion. Thus, printed wiring boards 200 and 300 of four-layer configuration are separated from both surfaces of the support substrate 100. COPYRIGHT: (C)2011,JPO&INPIT |
