发明名称 System and Method for Microelectronics Lamination Press
摘要 The system contains a lamination press. The first cavity is formed in a chassis. A film assembly is fitted within the chassis. A buffer mounts over the film assembly and within the chassis. A tool set is shaped to fit within the first cavity. The tool set and chassis are positioned within the lamination press to confer heat and pressure from the lamination press to the film assembly and chassis.
申请公布号 US2010263788(A1) 申请公布日期 2010.10.21
申请号 US20090427317 申请日期 2009.04.21
申请人 发明人 LAHOOD JOHN;HARDY EDWARD
分类号 B32B37/10 主分类号 B32B37/10
代理机构 代理人
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