| 摘要 |
PURPOSE: An LED package, an LED heat radiating device, and an LED socket using the same are provided to improve light efficiency by efficiently transmitting heat from an LED to the outside by removing a PCB between an LED and a heat sink. CONSTITUTION: A protrusion(213) is formed on the upper side(212) of a heat sink(210). The heat sink discharges heat from an LED package(200) to the outside through a heat radiation fin(211). The LED package is installed on the upper side of the heat sink. The LED package includes an LED chip(230) and a solder pad(222) connected with a bonding wire(224). A PCB(240) is connected to the solder pad of the LED package with soldering. |
