| 摘要 |
<p>Provided is a method for manufacturing a wafer lens, wherein sink marks and voids are not generated even in a thick portion of a lens section and rapid hardening and shrinkage of the wafer lens can be eliminated. The method is provided with: a dispense step of dropping or applying, between a molding die and one surface of a substrate, a resin material which contains a photocurable resin, a first initiator, which is sensitive with a first wavelength of a predetermined wavelength or shorter and generates radicals with the first wavelength, and a second initiator, which is sensitive with a second wavelength on the side of a longer wavelength than the predetermined wavelength and generates radicals with the second wavelength; an imprint step of pressing the resin material to the molding die or the substrate; a first light radiating step of radiating light through a filter that cuts light of the predetermined wavelength or shorter and promoting curing of the resin material; and a second light radiating step of radiating light to the resin material by removing the filter and further promoting curing.</p> |
