| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve high heat dissipation and to alleviate package warpage in an electronic device on which an electronic device element, such as, a light emitting element or an integrated circuit is loaded. <P>SOLUTION: The electronic device element is arranged in the center area of the upper surface of a base made of a ceramic material via a first heat transfer layer constituted of a metallic material; a first heat dissipating layer comprising the metallic material is formed in the central area of the lower surface of the base; and a plurality of thermal vias comprising the metallic material and connecting the first heat transfer layer and the first heat dissipation layer are buried in the base. Furthermore, a second heat transfer layer comprising the metallic material and extending from a position above the center area of the lower surface of the base to a position above the peripheral area of the lower surface of the base is embedded in the base, crossing the plurality of thermal vias. <P>COPYRIGHT: (C)2011,JPO&INPIT |
