发明名称 Verfahren zum Reparieren einer Öffnung und eines Risses in einem Teil durch Schweissen unter Verwendung eines Einsatzes mit Oben- und Seitenplatten und einem Unterlageelement
摘要 <p>The invention relates to a method of repairing an aperture and adjacent defect in a part, which is started by removing one or more defects adjacent an aperture in a base material (14). The material (14) is removed to create a weld seam that extends past an area of high stress concentration on the aperture. An insert of material (34) containing a profile that corresponds to the profile of the base material removed adjacent the aperture and a combination top and runoff plate (24) that encompasses the insert of material (34) are provided. A backing plate (36) is inserted underneath the combination top and runoff plate (24) and insert (34) such that there remains an air space between the backing plate (36) and the combination plate (24) which prevents the combination plate from becoming fused to the backing plate (36) during a welding process. The insert (34) is welded to the base material (14), and the backing plate (36) is removed. Excess material is removed from the insert (34) to obtain an aperture containing a profile essentially the same as the profile of the aperture prior to initiating the repair.</p>
申请公布号 DE602007009011(D1) 申请公布日期 2010.10.21
申请号 DE20076009011T 申请日期 2007.10.29
申请人 UNITED TECHNOLOGIES CORP. (N.D.GES.D. STAATES DELAWARE) 发明人 BERANGER PHILIP R.
分类号 B23K15/00;B23K28/00;B23K31/02;B23K33/00;B23P6/00;F01D5/00 主分类号 B23K15/00
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