| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the sufficient capability of the stress relaxation of a cured anisotropically conductive film, and to prevent prominence or removal at an interface between the cured anisotropically conductive film and an electronic component or a wiring board when the electronic component of which the terminal height is low is connected to the wiring board through the anisotropically conductive film in an anisotropically conductive manner. <P>SOLUTION: A connection structure in which a terminal of a first electronic component is connected to a terminal of a second electronic component trough an anisotropically conductive film in an anisotropically conductive manner includes: as the first electronic component, at least a pair of terminals disposed on the surface of an anisotropically conductive film side with a first insulating layer between the pair of terminals; and, as the second electronic component, a recessed portion formed at the surface opposite to the first insulating layer of the first electronic component with a second insulating layer at the bottom of the recessed portion. <P>COPYRIGHT: (C)2011,JPO&INPIT |
