发明名称 SOLDERING TOOL
摘要 PROBLEM TO BE SOLVED: To attain stable and sure soldering of a post-attached component without much labor. SOLUTION: In a first plate 11 on which a circuit board 10 is to be mounted, an opening 16 through which a soldered surface of the mounted circuit board is exposed is formed, a presser pin 22a is provided on a second plate 12 covering the board 10 not to remove the board 10 and circuit components 15 on the board 10, and both plates 11, 12 are attached together by means of a hinge 13 to freely open/close. The circuit board 10 is mounted on the first plate 11 with the soldered surface directed downward, thereafter the components 15 are mounted and the second plate is closed. Thus, the pin 22a provided on the second plate 12 presses the board 10 and the components 15 mounted on the board 10 to fix them not to fall and float. When the plates 11, 12 are reversed to direct the opening 16 upward in this state, the soldered surface of the board 10 is exposed through the opening 16 and hence soldering of the later attached components 15 can be stably and surely performed without labor. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010238962(A) 申请公布日期 2010.10.21
申请号 JP20090086050 申请日期 2009.03.31
申请人 ICOM INC 发明人 SEKIMOTO NOBUHIKO
分类号 H05K3/34;B23K3/00;B23K101/42 主分类号 H05K3/34
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