| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil belt for printed wiring board that is advantageous for both adhesive property with an insulating substrate and etching performance and is controlled in containing amount of Cl. SOLUTION: The copper foil for printed wiring board includes a copper foil base material belt and a covering layer for covering at least a part of the front surface of the copper foil base material belt. In this copper foil for printed wiring board, (1) the covering layer is constituted with a Ni layer and a Cr layer sequentially stacked from the front surface of the copper foil base material belt, (2) the covering layer includes Cr in the covering amount of 15 to 210μg/dm<SP>2</SP>and Ni of 15 to 440μg/dm<SP>2</SP>, (3) the cross-section of the covering layer observed with a transmission electron microscope has the maximum thickness of 0.5 to 5 nm and the minimum thickness of 80% or greater of the maximum thickness, and (4) atomic concentration of Cl existing between the copper foil base material belt and the covering layer is under 0.1%. COPYRIGHT: (C)2011,JPO&INPIT
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