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发明名称
METHOD FOR SOLDERING SMD COMPONENTS ON A PRINTED CIRCUIT BOARD AND REFLOW SOLDERING FURNACE THEREFOR
摘要
申请公布号
EP1917844(B1)
申请公布日期
2010.10.20
申请号
EP20060777763
申请日期
2006.07.13
申请人
ENDRESS+HAUSER GMBH+CO. KG
发明人
BIRGEL, DIETMAR;HAUPTVOGEL, KARL-PETER
分类号
H05K3/34
主分类号
H05K3/34
代理机构
代理人
主权项
地址
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