| 摘要 |
PURPOSE: A stacked semiconductor package is provided to improve data process speed and data storage capacity by mounting more semiconductor chips per unit volume. CONSTITUTION: A semiconductor chip module(200) is arranged on a substrate(100). A connection member(300) is arranged on the semiconductor chip module. A conductive member(400) electrically connects the substrate, the semiconductor chip module, and the connection member. The substrate includes a connection pad(130), a ball land(140), and a connection member(150). The connection pad is electrically connected to the ball lands. |
