发明名称 CAMERA MODULE PACKAGE
摘要 PURPOSE: A camera module package for performing an image capturing function is provided to maximize the effect of intercepting electromagnetic wave without additional soldering process. CONSTITUTION: A camera body(110) accepts a lens. An image sensor images the light through the lens. A receiving unit is formed in an electrode pattern. A grounding unit(134) is grounded in an external ground layer.
申请公布号 KR20100112810(A) 申请公布日期 2010.10.20
申请号 KR20090031289 申请日期 2009.04.10
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 HAN, CHUL MIN
分类号 H04N5/225;H01L27/14 主分类号 H04N5/225
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