发明名称 ADHESIVE-FREE FLEXIBLE LAMINATE
摘要 <p>Provided is a non-adhesive flexible laminate comprising a polyimide film at least one surface of which has been plasma-treated, a tie-coat layer formed on the plasma-treated surface, a metal seed layer formed on the tie-coat layer, and a metal conductor layer formed on the metal seed layer, wherein a ratio Á p /Á t of actual density Á p to theoretical density Á t of the tie-coat layer satisfies Á p /Á t > 0.6. The invention aims to improve the adhesion between the metal layer and the polyimide film of the non-adhesive flexible laminate (in particular a two-layered metalizing laminate).</p>
申请公布号 EP2241436(A1) 申请公布日期 2010.10.20
申请号 EP20080872091 申请日期 2008.12.25
申请人 NIPPON MINING & METALS CO., LTD. 发明人 MAKINO, NOBUHITO;HOKURA, AKITO;INAZUMI, HAJIME
分类号 B32B15/088;B32B15/08;C23C28/02;H05K1/03 主分类号 B32B15/088
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