| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve productivity of flip-chip connection, in a semiconductor device mounter comprising a pad for external connection and a method for manufacturing it. <P>SOLUTION: This semiconductor device mounter is provided with a semiconductor device comprising a semiconductor chip having the pad for external connection, an insulating layer formed on a surface having the pad of the semiconductor chip, and a conductor layer which is formed on the insulating layer, has a larger area than that of the pad, and electrically connected to the pad with a conductor penetrating through the insulating layer; and a wiring board on which the semiconductor device is mounted. The conductor layer of the semiconductor device is electrically connected to a wiring pattern of the wiring board through a conductive composition comprising conductive particles and a resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
