Inductive sensor module and inductive proximity sensor

摘要

The sensor module (10) has a carrier (12) on which electronic components (60) are arranged. A coil arrangement (18) is arranged on a front side (14) of the carrier, and the electronic components are arranged on a rear side (16) of the carrier directed away from the front side. The coil arrangement comprises a pot core (36) and a coil, where the pot core is seated on a board (20) i.e. printed circuit board. The board is arranged on the front side of the carrier. The board has electrical contact areas, which provide electrical contact paths from a side facing the pot core to the carrier. An independent claim is also included for an inductive proximity sensor comprising an interconnection device that is electrically connected with an inductive sensor module.