SEMICONDUCTOR PACKAGE USING GROUND IMPEDANCE TO REMOVE POWER NOISE IN A PACKAGE

摘要

PURPOSE: A semiconductor package to remove power noises in a package by using ground impedance is provided to reduce a ground inductance level by decreasing loop inductance and a return current path. CONSTITUTION: A digital circuit block(111a,111b) and an analog circuit block(121) are formed on a circuit board(100). An integrated ground(110) provides the equipotential of the digital circuit block and the analog circuit block. A digital ground impedance(125) electrically connects the digital circuit block with the integrated ground. The digital circuit block is connected to the integrated ground through the digital ground impedance. The analog circuit block is connected to the integrated ground through the analog ground impedance.