ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL FURNISHED WITH PRIMER RESIN LAYER AND PROCESS FOR PRODUCING THE SAME

摘要

Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni-Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.