| 摘要 |
A stack structure of a carrier board embedded with semiconductor components and a method for fabricating the same are provided to reduce a manufacturing cost by simplifying a semiconductor manufacturing process. One or more through-hole is formed at a first and second carrier boards(21a,21b). A first protective layer is formed on one surface of the first carrier board in order to seal the through-hole of the first carrier board. A second protective layer is formed on one surface of the second carrier board in order to seal the through-hole of the second carrier board. A first semiconductor component(23a) is formed in the through-hole of the first carrier board. A second semiconductor component(23b) is formed in the through-hole of the second carrier board. A dielectric layer(24) is laminated on other surfaces of the first and second carrier boards. The though-holes of the first and second boards are filled with a dielectric. A package structure is formed by removing the first and second protective layers. |
