SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor device and a method of manufacturing the same are provided to prevent a process fail due to the misalignment of a conductive pattern and a connection member by forming an opening which is self-aligned along the center of the connection member. CONSTITUTION: A substrate(100) comprises at least one lower conduction pattern. A first interlayer insulating film(200) having a first opening(205) exposes the conductive pattern. A connection member(210) fills the first opening to be connected to the lower conduction pattern. A second interlayer insulating layer(500) includes a second opening having the same central shaft as the connection member. An upper conductive pattern(510) files the second opening to be connected to the connection member.