Method and apparatus for severing disks of brittle material, in particular wafers

摘要

The invention is directed to a method in which disks, particularly wafers, of brittle material are severed along planned severing lines by a laser by introducing thermal stresses. The temperature gradient required for this and the compressive stresses and tensile stresses resulting from it are generated in that the disk is first cooled proceeding from its underside at least along the planned severing lines toward the upper side of the disk, and the upper side of the disk is then acted upon by a laser beam along the planned severing lines. The description also relates to an apparatus for carrying out the method.