SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to make the top side of a die pad, having the contact with an insulating resin, rough and to allow the back side of the die pad and an outer lead to be smooth. CONSTITUTION: A die pad is comprised of a conductive material. A plurality of lead portions(LD1) have an inner lead and an outer lead. A suspending lead unit(SL1) is formed at the end of a die pad. A semiconductor chip(CP1) mounts a die bounding member(DB1) on the die pad. A plurality of lead portions and semiconductor chips are connected to each other through a plurality of bonding wirings. An insulating resin(IR1) hermetically seals the semiconductor chip.