发明名称 Method of manufacturing composite wafer structure
摘要 The invention provides a method of manufacturing a composite wafer structure. In particular, the method, according to the invention, is based on the fracture mechanics theory to actively control fracture induced during the manufacture of the composite wafer structure and to further protect from undesired edge damage. Thereby, the method, according to the invention, can enhance the yield rate of industrial mass production regarding the composite wafer structure.
申请公布号 US7816233(B2) 申请公布日期 2010.10.19
申请号 US20050245163 申请日期 2005.10.07
申请人 SINO-AMERICAN SILICON PRODUCTS INC. 发明人 YEH JER-LIANG;HUANG JING-YI;HSU WEN-CHING;HO YA-LAN;HSU SUNG-LIN;WANG JUNG-TSUNG
分类号 H01L21/46 主分类号 H01L21/46
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