发明名称 |
Alignment mark and defect inspection method |
摘要 |
A defect inspection method is disclosed. A first type defect inspection system is used to perform a first defect inspection by aligning to an alignment mark on a wafer as a reference point for the first defect inspection. A fabrication process is performed on the wafer thereafter, and a second defect inspection is performed by using a second type defect inspection system to align the alignment mark on the wafer as the reference point for the second defect inspection.
|
申请公布号 |
US7817265(B2) |
申请公布日期 |
2010.10.19 |
申请号 |
US20080237404 |
申请日期 |
2008.09.25 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
CHOU LING-CHUN;CHEN MING-TSUNG;LIU HSI-HUA;LEI SHUEN-CHENG;TSAO PO-CHAO |
分类号 |
G01N21/00 |
主分类号 |
G01N21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|