PURPOSE: A light emitting diode package is provided to increase the quantity of light in order to improve light efficiency by minimizing light interference between plurals of light emitting diode chips. CONSTITUTION: A first reflecting surface(51) is located on the outer circumference of a first loading surface(41). A first light emitting diode chip(10) is mounted on the first loading surface. A first lateral side(11) is arranged on the first light emitting diode chip. A second light emitting diode chip(20) is mounted on the first loading surface. A second lateral side(22) is arranged on the second light emitting diode chip.
