发明名称 SiC semiconductor device having junction barrier schottky diode
摘要 A semiconductor device having a JBS diode includes: a SiC substrate; a drift layer on the substrate; an insulation film on the drift layer having an opening in a cell region; a Schottky barrier diode having a Schottky electrode contacting the drift layer through the opening and an ohmic electrode on the substrate; a terminal structure having a RESURF layer in the drift layer surrounding the cell region; and multiple second conductive type layers in the drift layer on an inner side of the RESURF layer contacting the Schottky electrode. The second conductive type layers are separated from each other. The second conductive type layers and the drift layer provide a PN diode. Each second conductive type layer has a depth larger than the RESURF layer.
申请公布号 US7816733(B2) 申请公布日期 2010.10.19
申请号 US20080078370 申请日期 2008.03.31
申请人 DENSO CORPORATION 发明人 OKUNO EIICHI;YAMAMOTO TAKEO
分类号 H01L29/24;H01L29/94 主分类号 H01L29/24
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