发明名称 |
Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the same |
摘要 |
The surface(s) of a polishing pad for polishing an object has a first portion including hydrophilic material and a second portion including hydrophobic material. The first portion of the polishing surface is located in a first region of the polishing pad and the second portion of the polishing surface is located in a second region of the polishing pad juxtaposed with the first region in the radial direction of the pad. The hydrophilic material may be a polymer resin that contains hydrophilic functional groups having OH and/or ═O at bonding sites of the polymer. The hydrophobic material may be a polymer resin that contains hydrophobic functional groups having H and/or F at bonding sites of the polymer. The polishing pad is manufactured by extruding respective lines of the hydrophilic and hydrophobic materials. The extruders and a backing are moved relative to each other such that the lines form concentric rings of the hydrophilic and hydrophobic materials.
|
申请公布号 |
US7815496(B2) |
申请公布日期 |
2010.10.19 |
申请号 |
US20070706241 |
申请日期 |
2007.02.15 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LIM YOUNG-SAM;KIM YOUNG-NAM;KIM GI-JUNG |
分类号 |
B24D11/00 |
主分类号 |
B24D11/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|