| 摘要 |
The present invention includes: a pre-step of preparing a substrate having on its surface a hydrophilic region that is surrounded by a water-repellent region and provided with a hydrophilic electrode; a first step of applying an electroless plating solution in which a metal compound is dispersed in water to the substrate to dispose an electroless plating solution in the hydrophilic region; a second step of applying an electronic device-dispersed liquid in which an electronic device having a device electrode is dispersed in a first liquid to the substrate to move the electronic device from the first liquid to the electroless plating solution so as to bring the device electrode into contact with the hydrophilic electrode; a third step of coating a surface of the substrate with a second liquid before the water contained in the electroless plating solution volatilizes completely to cause a plating reaction between the hydrophilic electrode and the device electrode and to connect electrically the hydrophilic electrode and the device electrode; and a fourth step of removing the second liquid from the substrate.
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