发明名称 |
Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same |
摘要 |
Disclosed are PQFN semiconductor die packages for high-voltage, high-power applications, systems using the packages, and methods of making the packages. An exemplary package comprises a leadframe, a semiconductor die disposed on the leadframe, and a heat sink member disposed on the semiconductor die and the leadframe and integrated into the molding material of the package. The heat sink member has an electrically insulating substrate with a high breakdown voltage, and one or more conductive layers disposed on a first surface of the substrate that electrically interconnect the semiconductor to one or more leads of the leadframe. |
申请公布号 |
US7816784(B2) |
申请公布日期 |
2010.10.19 |
申请号 |
US20080337513 |
申请日期 |
2008.12.17 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
SON JOON-SEO;MANATAD ROMEL N.;JEREZA ARMAND VINCENT |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|