| 发明名称 |
Formation of circuitry with modification of feature height |
| 摘要 |
A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.
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| 申请公布号 |
US7816251(B2) |
申请公布日期 |
2010.10.19 |
| 申请号 |
US20080291853 |
申请日期 |
2008.11.14 |
| 申请人 |
TESSERA, INC. |
发明人 |
HABA BELGACEM;BEROZ MASUD;KIM YOUNG-GON;TUCKERMAN DAVID B. |
| 分类号 |
H01L21/44;H01L23/13;H01L23/498 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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