发明名称 |
Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package |
摘要 |
An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.
|
申请公布号 |
US7816785(B2) |
申请公布日期 |
2010.10.19 |
申请号 |
US20090357744 |
申请日期 |
2009.01.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
IRUVANTI SUSHUMNA;KEMINK RANDALL G.;KUMAR RAJNEESH;OSTRANDER STEVEN P.;SINGH PRABJIT |
分类号 |
H01L23/10 |
主分类号 |
H01L23/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|