发明名称 RESIST COATING DEVELOPING APPARATUS, RESIST COATING DEVELOPING METHOD AND RESIST FILM PROCESSING APPARATUS
摘要 <p>PURPOSE: A resist application and development apparatus, a resist application and development method, and a resist film processing apparatus are provided to reduce the roughness of a line width by smoothing a resist pattern. CONSTITUTION: A cassette station(2) comprises a loading part(6), in which cassettes are loaded, and a wafer carrier(7). A wafer carrier transfers a wafer(W) between the cassettes and a processing station(3). A main transferring unit(13) is installed on the center of the processing station. Four processing groups are arranged around the main transferring unit. A third processing group(G3) is adjacently arranged to the cassette station. A fourth processing group(G4) adjacently arranged to an interface unit(4).</p>
申请公布号 KR20100112089(A) 申请公布日期 2010.10.18
申请号 KR20100031667 申请日期 2010.04.07
申请人 TOKYO ELECTRON LIMITED 发明人 INATOMI YUICHIRO
分类号 H01L21/027 主分类号 H01L21/027
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