METHOD OF MANUFACTURING LEAD FRAME, METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for manufacturing a lead frame and a method for manufacturing a semiconductor package are provided to improve the efficiency of a manufacturing process by forming a multi-rowed lead through one etching operation. CONSTITUTION: An upper plating layer(22a) and a lower plating later(22b) are formed on a substrate(21). Adhesive is applied to the lower plating layer. A fixing stand is attached to the lower plating layer. A plurality of isolated lands is generated by eliminating the exposed parts of the substrate. Filler fill a space around the isolated lands.