CARRIER PLATE FOR FORMING EXTERNAL ELECTRODES, AND MANUFACTURING METHOD

摘要

Provided are a carrier plate for forming external electrodes, and a manufacturing method. The present invention provides a carrier plate on which a plurality of chip components are fixed to form external electrodes on respective outer surfaces of the chip components, wherein said carrier plate comprises: at least one chip-holding area formed at both sides of a metal plate; a plurality of open holes which penetrate through the bottom surface of the chip-holding area and which are arranged with a predetermined spacing; and a rubber layer which is formed into a predetermined thickness on the chip-holding area such that the rubber layer covers the chip-holding area and has support holes formed in the respective open holes, wherein each of said support holes has an inner diameter smaller than that of each of said open holes, and enables the chip components to be inserted into the respective support holes such that outer surfaces of the chip components contact the respective inner surfaces of the support holes. The chip-holding area is recessed such that the bottom surface thereof is lower than the surface of the metal plate.