| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a wiring board, capable of high-density mounting without increasing the thickness of a wiring board. SOLUTION: This semiconductor device 10 includes this wiring board 20, and an electronic component 30 mounted on the wiring board 20. The wiring board 20 includes a wiring pattern 21, an insulation layer 22, and auxiliary pads 23. The wiring pattern 21 includes wires 24 and mounting pads 25 each having a diameter larger than the width of the wire 24. The insulation layer 22 covers the surface of the wiring pattern 21. The auxiliary pad 23 has a diameter larger than that of the mounting pad 25, and is arranged on the insulation layer 22 corresponding to the mounting pad 25. The electronic component 30 includes electrodes 31 each connected to the auxiliary pad 23 or the auxiliary pad 23 and the mounting pad 25 through a conductive member 40. COPYRIGHT: (C)2011,JPO&INPIT
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