| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface inspection apparatus and a method of inspecting a surface for quickly determining whether a pattern shape on a sample surface is appropriate without being affected by a change in an environmental temperature. SOLUTION: The surface inspection apparatus 100 for inspecting defects in a wafer 10 includes: an illumination optical system 21 that includes a polarizer 7a and an objective lens 9 and irradiates patterns formed on the surface of the wafer 10 with light from a light source 1 via the polarizer 7a and the objective lens 9; a detection optical system 22 that condenses reflection light from the surface of a sample by the illumination via the objective lens 9, and further detects an image of a pupil plane of the objective lens 9 through the polarizer 7a and an analyzer 12 disposed to satisfy crossed Nichol conditions; a temperature measurement section 20 for detecting an environmental temperature of the objective lens; a storage section 24 for storing the amount of rotation around the light axis of the polarizer 7a for maintaining crossed Nichol conditions corresponding to the environmental temperature; and a detection section 23 for extracting the amount of rotation corresponding to an environmental temperature output from the temperature measurement section 20 from the storage section and rotating the polarizer to reach the amount of rotation. COPYRIGHT: (C)2011,JPO&INPIT
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