| 发明名称 |
INTERCONNECT AND SYSTEM INCLUDING SAME |
| 摘要 |
An interconnect. The interconnect includes a thermal isolation structure and a layer of conductive material which covers the thermal isolation structure. The thermal isolation structure has a first end, a second end, and a sidewall.
|
| 申请公布号 |
US2010258348(A1) |
申请公布日期 |
2010.10.14 |
| 申请号 |
US20100755011 |
申请日期 |
2010.04.06 |
| 申请人 |
BRIDGE SEMICONDUCTOR CORPORATION |
发明人 |
ZIFF JOSHUA;ACQUAVIVA JOSEPH R.;WU CHIEN HUNG;JAN WILLIAM;BUENZLI CHARLES;KUAN NELSON |
| 分类号 |
H02G3/00;H01B5/14 |
主分类号 |
H02G3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
