发明名称 WIRING BOARD AND CONNECTION STRUCTURE
摘要 <p>Disclosed are: a wiring board which is an amorphous film that can be easily patterned by weak acid etching and has low resistance and high transmittance, said amorphous film being able to be easily crystallized and capable of forming a good junction through an anisotropic material; and a connection structure. Specifically disclosed is a wiring board having a wiring pattern that is formed on a transparent substrate, wherein the wiring pattern comprises a connection terminal part that is connected to a member to be connected through an anisotropic conductive material, and at least the surface layer of the connection terminal part is composed of a transparent conductive film that contains indium oxide, and if necessary tin, while containing 0.00001 mole or greater but less than 0.10 mole of barium per 1 mole of indium.</p>
申请公布号 WO2010116980(A1) 申请公布日期 2010.10.14
申请号 WO2010JP56194 申请日期 2010.04.06
申请人 MITSUI MINING & SMELTING CO., LTD.;TAKAHASHI SEIICHIRO;MORIUCHI SEIJI;IKEDA MAKOTO;MIYASHITA NORIHIKO 发明人 TAKAHASHI SEIICHIRO;MORIUCHI SEIJI;IKEDA MAKOTO;MIYASHITA NORIHIKO
分类号 C23C14/08;G09F9/30;H01B5/14;H01R11/01;H05K1/09 主分类号 C23C14/08
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