| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the warpage of a semiconductor device when the fillet width of an underfill resin is asymmetrical. <P>SOLUTION: The center position 12 of a chip 1 is caused to deviate from the center position 13 of a wiring board 2 in a direction (direction of the arrow B) reverse to the displacement direction (direction of the arrow A) of the center position 11 of an underfill resin 4 from the center position 12 of the chip 1. The center position 14 of a resin for encapsulation 6 is caused to deviate from the center position 13 of the wiring board 2 in the same direction (direction of the arrow A) as the displacement direction (direction of the arrow A) of the center position 11 of the underfill resin 4 from the center position 12 of the chip 1. <P>COPYRIGHT: (C)2011,JPO&INPIT |
