IMAGE PICKUP DEVICE PACKAGE AND IMAGING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an image pickup device package ensuring reliability of products by avoiding hollowing of light transmitting substrates even if metal patterns are formed by print or an environment changes.

SOLUTION: The image pickup device package is equipped with: the light-transmitting substrate 2 including a first metal 6; an element mounting substrate 3 including a second metal and mounting an image pickup device 10 connected to the second metal; a conductive joining member 4 for holding the first metal 6 and the second metal at a prescribed interval and electrically connecting the first metal 6 to the second metal in an outside position of the image pickup device 10; and a sealing layer 5 for sealing an image pickup region 11 of the image pickup device 10. A conductive ball 20 is mounted to an extension section 6b of the sealing layer 5 which is usually a non-contact position to an external edge of the sealing layer 5.

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