| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure for a semiconductor device and a method of mounting a semiconductor device which have superior connection reliability. SOLUTION: A mounting structure for a semiconductor device comprises a first substrate having a plurality of first terminals arranged along a predetermined direction and liquid repellent portions formed in a partial portion between the first terminals, a second substrate provided to face the first substrate while having a plurality of second terminals arranged correspondingly to the first terminals and having a semiconductor device connected to the second terminals, and an anisotropic conductive adhesive material that is held between the first terminals and the second terminals and contains a material being phobic to the liquid repellent portions, and electrically connects the first and second terminals. COPYRIGHT: (C)2011,JPO&INPIT
|
