| 摘要 |
PROBLEM TO BE SOLVED: To increase the reliability of connecting a circuit board with a semiconductor element in a semiconductor device, a method of manufacturing the same, and a circuit board sheet. SOLUTION: The method of manufacturing the semiconductor device includes the steps of: supplying connecting media 35 to extensions 30a of connection pads 30 provided on a circuit board 20; facing the connection pads 30 on the circuit board 20 to electrode terminals 38 of a semiconductor element 37; and melting the connecting media 35 with heat to move the molten connecting media 35 from the extensions 30a to the connection pads 30 and connecting the connection pads 30 and the electrode terminals 38 via the connecting media 35. COPYRIGHT: (C)2011,JPO&INPIT
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